ThermalRight LGA 1700-BCF-V2 Bending Corrector Frame (Black)

The Thermalright LGA 1700-BCF-V2 is a CPU contact frame, also called an anti-bending or bending corrector frame, that replaces the stock Intel ILM (Independent Loading Mechanism) on LGA1700 motherboards. Its whole reason for existing is one problem: Intel's stock retention bracket presses down through the middle of the CPU and warps the IHS over time, which leaves gaps between the processor and cooler and pushes temperatures up. The BCF-V2 swaps that bracket for a frame that holds the CPU flat and spreads the mounting force to the edges, restoring even cooler contact.

Key Features

• Replaces the stock Intel ILM to eliminate the center-pressure bending that warps LGA1700 processors
• Distributes clamping force to the edges of the CPU for a flatter IHS and better cooler contact
• CNC-machined from aluminum alloy with a sandblasted matte black finish
• LOTES-spec insulation foot pads spread pressure evenly and protect the CPU lid across repeated installs
• Frame design helps keep thermal paste from squeezing out past the edges of the CPU
• Compatible with Intel 12th, 13th and 14th Gen processors on the LGA1700 socket (H610, B660, Z690, B760 and Z790 boards)
• Includes an L-shaped screwdriver so installation needs no extra tools

A small, low-cost upgrade that can meaningfully drop LGA1700 CPU temperatures by fixing socket bending and restoring flat cooler contact.